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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Driving Operational Efficiencies at Summit Interconnect
January 23, 2024 | Barry Matties, I-Connect007Estimated reading time: 1 minute
As the largest privately held printed circuit board manufacturer in North America, with headquarters in Irvine, California, Summit Interconnect has eight facilities, including one assembly shop. Coming back into the industry after a career move that took him to Amazon, Summit COO Sean Patterson reflects on the issues of culture, the new workforce and PCB capacity issues in the United States, to name just a few.
Barry Matties: As chief operating officer for Summit Interconnect, what's a typical day like for you?
Sean Patterson: My day starts with checking in on the day's production, working with sales on upcoming quotes from a customer perspective, and then getting into larger projects for the rest of the day with an eye toward our long-term vision. Overall, I’m looking at our operations from the day before as well as trends from the prior weeks for all our eight facilities. Seven are fabrication facilities and one is a quick-turn assembly shop.
Matties: You have made some acquisitions, the most recent being Royal Circuits in Hollister, California. Is that right?
Patterson: Yes, there was Royal Circuits in Hollister, Advanced Assembly in Denver, and South Coast Circuits in Santa Ana, California.
Matties: You're operating in California, perhaps one of the most expensive states to do business. What’s your strategy for offsetting costs?
Patterson: We focus on efficiency and verifying our processes up front before we start production. This maximizes our workforce to keep labor costs down. We also focus on employee retention by providing long term career planning with opportunities to move into higher level engineering positions.
Matties: How do you help your employees take advantage of paid training?
Patterson: At IPC this year, of the 20 people who went through the Emerging Engineering program, eight were from Summit, so we had the largest team there. It's healthy that we all cooperate to bring more people into the industry and not just move them from site to site. That's not helping our industry. We want to continue that IPC training, developing a career path throughout our company and within the industry.
To read this entire conversation, which appeared in the January 2024 issue of PCB007 Magazine, click here.
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Summit Interconnect Marks 10 Years of Precision Manufacturing
04/03/2026 | Summit Interconnect, Inc.Summit Interconnect, the largest privately held printed circuit board (PCB) manufacturer in North America, marks its tenth anniversary, a milestone that reflects a decade of bold acquisitions, pioneering technology investments, and an enduring mission: to enable customer success through the highest-reliability PCB manufacturing on the continent.
My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/27/2026 | Marcy LaRont, I-Connect007 MagazineIt’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!
Growing an Engineer: Meet Emerging Engineer Julian Vega
02/25/2026 | Marcy LaRont, I-Connect007 MagazineJulian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit
02/23/2026 | SiemensSiemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.