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Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea

08/21/2024 | SEMI
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.

Summit Interconnect Welcomes Bobby Johnson as New Vice President of Human Resources

07/19/2024 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing, is pleased to announce the appointment of Bobby Johnson as the new Vice President of Human Resources. Johnson brings a proven track record in human resources leadership, making him a valuable addition to the Summit Interconnect team.

Summit Interconnect Appoints David Lane as New General Manager and VP of Denver-based Advanced Assembly

06/13/2024 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.

Jabil Expands Cloud-Server Capabilities

05/29/2024 | Jabil
Jabil Inc. announced the latest advancements to its configure-to-order, high-performance server platform, including the J312-S and J322-S models.

Peter Sarmanian Corporate Recognition Award: Summit Interconnect

05/23/2024 | I-Connect007 Editorial Team
Congratulations to Summit Interconnect for receiving the 2024 Peter Sarmanian Corporate Recognition Award. This award was named for a former IPC Board Chairman and recognizes an IPC-member company in the printed board industry (PCB) that has supported IPC through participation in technical and management programs while providing leadership for the industry.
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