It’s Only Common Sense: Customers Capabilities—and Confidence
Marcy’s Musings: Operating Without a Rulebook
Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Summit Interconnect Welcomes Alfred Macha as New Vice President & General Manager
January 25, 2024 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect, a leading manufacturer of advanced PCBs, is pleased to announce that Alfred Macha has joined the company as Vice President and General Manager. In this role, Mr. Macha will be responsible for overseeing operations of Summit’s Santa Clara facility and contributing to the continued growth and success of Summit Interconnect. With an extensive background in the electronics manufacturing industry, Alfred brings a wealth of experience and leadership to his new position.
“As Summit continues to focus on efficiency, quality, and on-time delivery, I’m confident that Alfred’s strong leadership will help us implement best-in-class processes not only in Santa Clara, but across our other facilities as well,” said Sean Patterson, COO of Summit Interconnect. “We are pleased to have him join our team and looking forward to his contributions as we push the boundaries of what’s possible in PCB manufacturing.”
Macha brings more than 25 years of manufacturing experience to Summit Interconnect. His career includes leading contract engineering services and manufacturing for biotechnology, medical, and specialized industrial applications. He also managed operations for high-reliability aerospace and military programs, and he has extensive background in quality, including working as the Director of Quality for both TTM Technologies and Sanmina-SCI.
“Summit is at the forefront of manufacturing growth within the United States,” said Alfred Macha. “We have a tremendous opportunity to partner with our customers to meet their needs for both complex PCB manufacturing and fast turn-times. I’m excited to see what can be achieved when we leverage Summit’s experience and technology for the benefit of design engineers around the world.”
Macha holds a B.S. in Industrial Engineering from the University of Arizona and an MBA in Operations Management from the W.P. Carey School of Business at Arizona State University. He is bilingual in English and Spanish.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Summit Interconnect Marks 10 Years of Precision Manufacturing
04/03/2026 | Summit Interconnect, Inc.Summit Interconnect, the largest privately held printed circuit board (PCB) manufacturer in North America, marks its tenth anniversary, a milestone that reflects a decade of bold acquisitions, pioneering technology investments, and an enduring mission: to enable customer success through the highest-reliability PCB manufacturing on the continent.
My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/27/2026 | Marcy LaRont, I-Connect007 MagazineIt’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!
Growing an Engineer: Meet Emerging Engineer Julian Vega
02/25/2026 | Marcy LaRont, I-Connect007 MagazineJulian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit
02/23/2026 | SiemensSiemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.