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ESA Exclusively Approves Ventec VT-901 Material in ACB Belgium's HDI Rigid PCB Qualification
January 30, 2024 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards. With this recently obtained ESA qualification, ACB is currently the only PCB manufacturer able to offer HDI technology within an ESA qualified domain.
Ventec's VT-901 polyimide material offers exceptional reliability performance, meeting the demanding requirements of ACB's HDI PCB manufacturing process that adheres to ESA standards. It has a high Td of 395°C, a Tg of 250°C, and a Low-Axis CTE of 50.
Ventec manufactures all VT-901 polyimide using custom treaters equipped with advanced filtration systems and 100% Automated Optical Inspection (AOI) to ensure strict FOD-control and adherence to the IPC4101E Appendix A inspection standards for materials for space applications. The same specialized equipment is utilized to manufacture thin-core laminates that are specifically designed for the most challenging space and aerospace printed circuit board applications. ACB's advanced PCB manufacturing plant in Dendermonde, Belgium, together with Ventec's AS9100 Rev D accreditation for their manufacturing and distribution facilities, establish both firms as leaders in the supply of space and aerospace electronics.
Joachim Verhegge, ACB Belgium's Plant Director, says: “Further to our already existing ESA approval for Ventec’s VT-901 polyimide material in our Sequential Rigid and Rigid-Flex applications, we are pleased to now receive our ESA HDI technology qualification. This latest approval further reaffirms our position as a top-tier PCB manufacturer for the next generation of space programs.”
Peter Coakley, Ventec Director of Sales EMEA, commented: “We have a long-standing technology partnership with ACB, and I'm happy to support them in further strengthening their position as a leading provider of aerospace-standard PCBs. Ventec VT-901 polyimide's thermal resilience and suitability for usage in high reliability rigid and flex rigid multi-layers in the demanding aerospace sector are demonstrated by the most recent ESA approval for HDI Rigid applications.”
Ventec International is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions.
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Brent Fischthal - Koh YoungSuggested Items
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04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Volatile Metals Market Creates PCB Pricing Headache
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AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.