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ESA Exclusively Approves Ventec VT-901 Material in ACB Belgium's HDI Rigid PCB Qualification
January 30, 2024 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards. With this recently obtained ESA qualification, ACB is currently the only PCB manufacturer able to offer HDI technology within an ESA qualified domain.
Ventec's VT-901 polyimide material offers exceptional reliability performance, meeting the demanding requirements of ACB's HDI PCB manufacturing process that adheres to ESA standards. It has a high Td of 395°C, a Tg of 250°C, and a Low-Axis CTE of 50.
Ventec manufactures all VT-901 polyimide using custom treaters equipped with advanced filtration systems and 100% Automated Optical Inspection (AOI) to ensure strict FOD-control and adherence to the IPC4101E Appendix A inspection standards for materials for space applications. The same specialized equipment is utilized to manufacture thin-core laminates that are specifically designed for the most challenging space and aerospace printed circuit board applications. ACB's advanced PCB manufacturing plant in Dendermonde, Belgium, together with Ventec's AS9100 Rev D accreditation for their manufacturing and distribution facilities, establish both firms as leaders in the supply of space and aerospace electronics.
Joachim Verhegge, ACB Belgium's Plant Director, says: “Further to our already existing ESA approval for Ventec’s VT-901 polyimide material in our Sequential Rigid and Rigid-Flex applications, we are pleased to now receive our ESA HDI technology qualification. This latest approval further reaffirms our position as a top-tier PCB manufacturer for the next generation of space programs.”
Peter Coakley, Ventec Director of Sales EMEA, commented: “We have a long-standing technology partnership with ACB, and I'm happy to support them in further strengthening their position as a leading provider of aerospace-standard PCBs. Ventec VT-901 polyimide's thermal resilience and suitability for usage in high reliability rigid and flex rigid multi-layers in the demanding aerospace sector are demonstrated by the most recent ESA approval for HDI Rigid applications.”
Ventec International is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Confronting an Era of Transformation in Europe
01/13/2026 | Marcy LaRont, I-Connect007If 2024 and 2025 felt turbulent inside your factory walls, the data now confirms it: Europe’s electronics manufacturing sector has entered a period of significant transition. At productronica, the Global Electronics Association’s industry intelligence team presented an overview of the European EMS industry, and what emerged was more than a portrait of a market cycling down.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/09/2026 | Nolan Johnson, SMT007 MagazineHappy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
01/07/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Texas Instruments Starts Production at New 300mm Fab in Sherman, Texas
01/02/2026 | Texas InstrumentsTexas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground.
Safran Develops Eurofl’Eye, the New Advanced Vision Technology for NH90 Helicopters
12/30/2025 | SafranSafran Electronics & Defense announces the signing of a major contract with the NATO Helicopter Management Agency (NAHEMA) for the development of the Eurofl’Eye distributed panoramic vision system.