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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/26/2024 | Nolan Johnson, I-Connect007
This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3

07/24/2024 | I-Connect007 Editorial Team
This chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.

Lockheed Martin’s Skunk Works, KX Shaping the Future of Open Mission System Architectures

07/23/2024 | BUSINESS WIRE
At the Farnborough Air Show, Skunk Works®, the renowned Advanced Development Programs division of Lockheed Martin (NYSE: LMT), and KX, a global leader in vector-based, time-series data management, announced a new collaboration focused on the evolution of Open Mission System architectures.

New Breakthrough in Double-Sided Reflow Part Retention from Alltemated

07/19/2024 | Alltemated
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.

Nanusens Solves Challenges of 6G RF Front end Design with its RF DTCs

07/18/2024 | Nanusens
Nanusens has announced that it has used its pioneering MEMS-within-CMOS™ technology to create a novel solution to the challenge of creating better RF front ends for 6G.
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