Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

TTM Technologies Plans $400M AI Infrastructure Investments in China and Malaysia

10/12/2026 | Globe Newswire
This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.

Applied Materials, Besi Expand Strategic Partnership

10/02/2026 | Applied Materials
Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner.

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.

Custom Interconnect to Exhibit at Microelectronics UK 2026

09/21/2026 | Custom Interconnect Ltd
Custom Interconnect is excited to exhibit at Microelectronics UK 2026 on Stand H60, at ExCeL London on 29 and 30 September.

Designers Notebook: Implementing Strategic Planning Principles for PCB Design

09/03/2026 | Vern Solberg -- Column: Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in