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New Podcast Series Launches: Optimize the Interconnect

07/10/2025 | I-Connect007
I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.

Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy

06/26/2025 | Summit Interconnect, Inc.
Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.

Thin Film Interconnect (TFI), Heisler Semiconductor LLC Announce Strategic Technology Partnership

06/04/2025 | PRNewswire
Thin Film Interconnect (TFI), based in Frederick, Maryland, is pleased to announce a strategic technology partnership with Heisler Semiconductor LLC, headquartered in Baltimore, Maryland.

DuPont Powers AI, Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025

06/04/2025 | PRNewswire
DuPont announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03,

Imec Demonstrates 16nm Pitch Ru Lines with Record-low Resistance Obtained Using a Semi-damascene Integration Approach

06/03/2025 | Imec
At the 2025 IEEE International Interconnect Technology Conference (IITC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents Ru lines at 16nm pitch with average resistance as low as 656Ω/µm.
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