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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Amphenol Announces First Quarter 2024 Dividend
February 1, 2024 | Amphenol CorporationEstimated reading time: Less than a minute
Amphenol Corporation announced that its Board of Directors approved the first quarter 2024 dividend on its Common Stock in the amount of $0.22 per share at its meeting held on January 31, 2024. The Company will pay this first quarter 2024 dividend on April 10, 2024 to shareholders of record as of March 19, 2024.
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Kimball Electronics Thailand Namlee School
12/26/2024 | Kimball ElectronicsKimball Electronics Thailand (KETL) has continued its commitment to supporting education and community development in Thailand.
Diverging Electrification Goals between Honda and Nissan; Accelerated Resource Integration will be the Top Priority Post-Merger
12/25/2024 | TrendForceHonda and Nissan—two of Japan’s largest automakers—announced on December 23rd, 2024, that they have entered into merger negotiations, with plans to finalize an agreement by June 2025. Mitsubishi Motors is also expected to join the partnership.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.