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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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IPC WinterCom 2024 in Photos
February 5, 2024 | Ana Gaceciladze, IPC EuropeEstimated reading time: Less than a minute
IPC WinterCom 2024, Jan. 22–25, in Barcelona, Spain, emerged as a dynamic hub for global collaboration in the electronics manufacturing industry. Bringing together around 300 leaders from 40 countries, the event showcased Europe's significant potential in standards development.
Discussions spanned diverse topics from design and materials to cutting-edge technologies. Key milestones included the advancement of IPC-8401 Guidelines for In-Mold Electronics and discussions on the revision of IPC-2231 for DFX. The Design Leadership Council gained momentum, supported by industry giants. The ninth Smart Plastics Congress highlighted technological marvels, symbolizing a commitment to industry-centric standards while being the most-attended meeting at the event.
During one of the networking lunches, Tiberiu Baranyi (technology group manager at Flextronics) and Debbie Wade (managing director at Advanced Rework Technology Limited) were both awarded Golden Gnomes for their achievements and contribution to the standards development within their industry. The event celebrated not just today's needs but the vibrant future of electronics manufacturing, reinforcing IPC's role as a global leader in innovation.
Check it all out in the photo gallery.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.