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Learning With Leo: The Study of Listening

10/07/2026 | Leo Lambert -- Column: Learning With Leo
For a long time, I thought a consultant was supposed to be the expert in the room. That was my model of the job for years. I can remember wondering how somebody relatively young could know enough to walk into an experienced organization and tell it what it should be doing differently. Four decades later, I have a different answer, and most of what changed my mind has come from the work we do at EPTAC. Between the classroom and the consulting side of the business, I end up in a lot of plants. The companies that call us are rarely short on expertise.

Real Time with... THECA 2026: DTECH Advances PCB Drilling for AI and High-Speed Systems

09/25/2026 | Real Time with... THECA
Sheryl Zheng, marketing manager at DTECH, discusses how AI and high-speed communications are reshaping PCB drilling requirements. She explains DTECH's evolution from a PCB tool specialist into a broader solutions provider and why drill-bit performance is becoming a more critical element of producing advanced, high-quality circuit boards.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.

August SMT007 Magazine: Cybersecurity Remains a Business Imperative

08/03/2026 | I-Connect007 Editorial Team
Although the Department of Defense recently suspended its planned rollout of mandatory third-party CMMC certification while it reviews the program, cybersecurity expectations across the defense supply chain remain firmly in place. This issue of SMT007 Magazine explores why manufacturers continue investing in stronger security, what CMMC Level 2 certification involves, and how leading EMS companies are navigating the process.

Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

08/04/2026 | I-Connect007
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.
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