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Triumph Wins Contract To Upgrade U.S. Army Chinook Helicopters
February 7, 2024 | PRNewswireEstimated reading time: 1 minute
Triumph Group, Inc. announced that its Systems, Electronics and Controls business in West Hartford, Connecticut has been awarded a five-year contract with the United States Army to provide an upgrade of the EMC32T Hydraulic Metering Assembly (HMA) fuel control on the T55 engines, supporting the CH-47 Chinook helicopter fleet. From 2024 through 2028, TRIUMPH will overhaul over (100) EMC32T HMAs per year to the latest configuration. This is the first contract to upgrade the fleet to the newest configuration as part of the U.S. Army's Component Improvement Program (CIP). TRIUMPH is uniquely positioned to provide this service as the original designer and manufacturer of the fuel control system.
"TRIUMPH is proud of our longstanding partnership with the U.S. Army and our ability to provide deep experience and expertise along with cost efficiency and increased reliability of the HMA," said Justin Wolfanger, President of TRIUMPH Systems, Electronics and Controls. "This five-year award strengthens that relationship while providing our military with the best equipment to support its mission."
TRIUMPH Systems, Electronics and Controls designs and manufactures, repairs, and overhauls a broad portfolio of aerospace and defense components, accessories, subassemblies, systems, and aircraft thermal management systems. We partner with original equipment manufacturers and operators of commercial, regional, and military aircraft worldwide to provide the products and services that solve the hardest of problems.
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Variosystems Strengthens North American Presence with Southlake Relaunch 2025
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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.