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ZDI Announces Altest's Acquisition of Viscom 8011 X-ray Inspection Equipment
February 9, 2024 | ZDIEstimated reading time: Less than a minute
Zero Defects International [ZDI] has announced the acquisition by Altest Corporation of a state of the art XRay inspection system for utilization in their printed circuit board assembly [PCBA] manufacturing facility located in San Jose, California. This X8011-III – 2D and 3D X-ray will enable high quality inspection usage and will further assure continued outstanding product performance as delivered to Altest customers.
Brian Seng, CEO, mentioned several selection factors including technical capabilities and equipment reliability as well as the importance of both Viscom and ZDI's well known reputations for technical service and support. The system is equipped with computer tomography to do failure analysis. This trend-setting, three dimensional inspection technique opens completely novel glimpses into the inner structure of an object that until now were not possible without destroying it. Additionally, the X8011-III X-ray system can be integrated into the production line and intelligently networked with other systems to optimize the manufacturing process. ZDI President, Michaela Brody, expressed appreciation for Altest’s selection in the context of a highly competitive environment for this type of equipment.
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Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
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