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ZDI Announces Altest's Acquisition of Viscom 8011 X-ray Inspection Equipment
February 9, 2024 | ZDIEstimated reading time: Less than a minute
Zero Defects International [ZDI] has announced the acquisition by Altest Corporation of a state of the art XRay inspection system for utilization in their printed circuit board assembly [PCBA] manufacturing facility located in San Jose, California. This X8011-III – 2D and 3D X-ray will enable high quality inspection usage and will further assure continued outstanding product performance as delivered to Altest customers.
Brian Seng, CEO, mentioned several selection factors including technical capabilities and equipment reliability as well as the importance of both Viscom and ZDI's well known reputations for technical service and support. The system is equipped with computer tomography to do failure analysis. This trend-setting, three dimensional inspection technique opens completely novel glimpses into the inner structure of an object that until now were not possible without destroying it. Additionally, the X8011-III X-ray system can be integrated into the production line and intelligently networked with other systems to optimize the manufacturing process. ZDI President, Michaela Brody, expressed appreciation for Altest’s selection in the context of a highly competitive environment for this type of equipment.
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Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.