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SMTA Introduces Ultra High Density Interconnect (UHDI) Symposium
February 9, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Density Interconnect Symposium will be held at the Peoria Sports Complex.
This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns. The program will focus on all areas impacted by the technology including PCB Design, Fabrication, Assembly and Reliability.
A co-located breakfast event will start the day with a discussion on the topic of workforce development, identifying key competencies for semiconductor technology and PCB electronics. The breakfast is open to anyone interested in workforce development for electronics manufacturing, not just conference attendees, and an additional registration fee is required to attend.
Altium and American Standard Circuits are the current sponsors of the symposium. Sponsorship opportunities are still available for this event.
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