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SMTA Ultra High-Density Interconnect Symposium Is Nearly Here

02/27/2024 | SMTA
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/23/2024 | Andy Shaughnessy, Design007 Magazine
It was a good week in PCB design and manufacturing. In this week’s wrap-up, we have news about an uptick in EMS shipments in January, a look at the current M&A climate, some guidance on investing in your company in order to stay competitive, a primer on designing with embedded capacitance materials, and a roadmap for the industry to embrace sustainable PCBs in the future.

 ROCKA Solutions' Justin Worden to Present at SMTA Dallas Expo & Tech Forum:

02/23/2024 |  ROCKA Solutions
 ROCKA Solutions is excited to announce that Justin Worden, Vice President of Sales & Marketing, will present at the upcoming SMTA Dallas Expo & Tech Forum. The event is scheduled to take place Tuesday, March 19, 2024 at the Plano Event Center.

North American PCB Industry Sales Down 3.9% in January 2024

02/23/2024 | IPC
IPC announced the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93.

Ventec Giga Solutions Announces Exclusive Refurbishment Service for PCB Lamination Plates

02/22/2024 | Ventec International Group
Ventec Giga Solutions, the equipment division of Ventec International Group, has started offering a refurbishment service for separator plates used in PCB lamination processes.
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