-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Calumet Electronics, Schmid Group Collaborate to Establish First-Ever US Advanced Substrate Facility
February 13, 2024 | SCHMID GroupEstimated reading time: 2 minutes
Calumet Electronics, a leading American printed circuit board manufacturer is pioneering the domestic production of advanced packaging substrates. The current development and onshoring of this technology are the direct result of a strategic partnership with Schmid Group (Schmid), a top global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries. This collaboration marks a significant step in advancing substrate technology within the United States (US) and complements the recent government grant awarded to Calumet by the US Department of Defense under DPA Title III.
Through this strategic partnership, Calumet and Schmid are working collaboratively to scale domestic production capacity for advanced substrates. Schmid is providing innovative equipment, while Calumet is taking the lead in expanding its manufacturing capabilities.
Together, they are aligning their efforts with construction milestones to establish the first-ever US-based advanced substrate facility.
Key Highlights:
1. Dedicated US-Based Advanced Technologies Facility: Calumet is currently standing up a 60,000 sq. ft. state-of-the-art manufacturing facility dedicated to advanced substrate production. This landmark facility represents a significant milestone as the first of its kind in the US, poised to advance substrate technology and enhancing the nation’s capabilities in advanced packaging.
2. Enabling Next-Gen Technology: The project will implement cutting-edge process and production technology, enabling the production of mSAP, SAP and (ET) embedded trace on a single versatile platform.
3. Environmental and Fiscal Responsibility: Calumet and Schmid’s R&D teams are collaborating across enterprises to develop a modular, space-efficient approach that maximizes environmental conservation, process efficiency, and cost savings while minimizing costly cleanroom footprints.
4. Substantial Capital Investment: The project is projected to attract a total capital investment of nearly $50 million. This substantial investment underscores the dedication to strengthening the US supply chain for microelectronics and printed circuit boards.
5. Government Support: Calumet received a significant investment from the US Department of Defense, which awarded them $39.9 million via the DPA Title III Program. This grant empowers Calumet, in collaboration with Schmid, to enhance manufacturing capabilities and contribute to national security.
6. Workforce Development: The partnership between Calumet and Schmid is driving technological advancements while focusing on upskilling the US workforce. By establishing advanced packaging and substrate manufacturing within the US, this collaboration creates sustainable jobs and strengthens domestic expertise.
At the forefront of the next-gen technology, advanced packaging and substrates are driving advancements in miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems. Engineered to cater to the specific requirements of high-performance systems, advanced substrates play a pivotal role in enhancing functionality and efficiency. This is poised to shape the future of advanced packaging technology in the US, uniting these two industry leaders for this purpose.
“The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States’ competitive position in the global market”, affirmed Stephen Vairo, President, and Chief Executive Officer of Calumet Electronics.
Christian Schmid, Schmid Group Chief Executive Officer, added “We are pleased to partner with Calumet to streamline the traditional lab-to-fab transition, in alignment with our shared mission as innovators and sustainable partners to the industry. We will create a lighthouse project in Calumet for the reshoring of technology and production to the US”.
Suggested Items
Northrop Grumman Honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Calumet Electronics Boosts PCB Production Capacity with Strategic CapX
04/05/2024 | Calumet ElectronicsCalumet Electronics is proud to announce a significant expansion of its domestic printed circuit board (PCB) production capacity at its campus in Michigan’s Upper Peninsula. Over the last four years, Calumet has strategically invested in manufacturing equipment, workforce development, and campus expansion.
A Progress Report: Investing in U.S. PCB Fabricators
12/19/2023 | Nolan Johnson, I-Connect007In the geopolitical arena, the supply chain lessons learned during the pandemic continue to be addressed with long-range plans as well as short-term stopgaps. In this conversation, David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), provides a progress update on the U.S. CHIPS Act, and some of the fan-out dynamics already playing out. As David explains, there is new investment in PCB fabrication that has nothing to do with the CHIPS Act.
Calumet Electronics Welcomes Trey Adams as Vice President and General Manager
11/21/2023 | Calumet ElectronicsCalumet Electronics is proud to announce the appointment of Trey Adams to their team as Vice President, General Manager. Adams, a veteran professional, brings a wealth of experience in PCB manufacturing to Calumet Electronics during a transitional period of growth and advancements.
DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs
11/16/2023 | U.S. DoDThe Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.