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Northrop Grumman Honors Calumet Electronics with Supplier Excellence Award

04/17/2024 | Calumet Electronics
Northrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation. 

Calumet Electronics Boosts PCB Production Capacity with Strategic CapX

04/05/2024 | Calumet Electronics
Calumet Electronics is proud to announce a significant expansion of its domestic printed circuit board (PCB) production capacity at its campus in Michigan’s Upper Peninsula. Over the last four years, Calumet has strategically invested in manufacturing equipment, workforce development, and campus expansion.

A Progress Report: Investing in U.S. PCB Fabricators

12/19/2023 | Nolan Johnson, I-Connect007
In the geopolitical arena, the supply chain lessons learned during the pandemic continue to be addressed with long-range plans as well as short-term stopgaps. In this conversation, David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), provides a progress update on the U.S. CHIPS Act, and some of the fan-out dynamics already playing out. As David explains, there is new investment in PCB fabrication that has nothing to do with the CHIPS Act.

Calumet Electronics Welcomes Trey Adams as Vice President and General Manager

11/21/2023 | Calumet Electronics
Calumet Electronics is proud to announce the appointment of Trey Adams to their team as Vice President, General Manager. Adams, a veteran professional, brings a wealth of experience in PCB manufacturing to Calumet Electronics during a transitional period of growth and advancements. 

DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs

11/16/2023 | U.S. DoD
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.
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