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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/14/2024 | Nolan Johnson, PCB007
This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.

Technology Days 2024 at Rehm: #opentochange

06/14/2024 | Rehm Thermal Systems
“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change.

IPC Masters 2024 Aims to Enhance Operator Skills in China

06/14/2024 | IPC
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.

Fabrinet Appoints Forbes Alexander to Board of Directors

06/14/2024 | BUSINESS WIRE
Fabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced that Forbes Alexander has been appointed to the Company’s Board of Directors, expanding the Board to eight members.

eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts

06/12/2024 | Zuken
Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design. 
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