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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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SMTA Capital Chapter Expo and Tech Forum Showcases Innovation in Electronics Manufacturing
February 19, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia. This event promises a dynamic platform for industry professionals and enthusiasts to explore the latest advancements and trends in electronics manufacturing.
Registration for the event is free, offering attendees access to various industry suppliers and a comprehensive agenda, including a keynote address, technical presentations, complimentary lunch, and a lively happy hour. The expo floor will feature leading suppliers specializing in conformal coatings, cleaning agents, inspection equipment, paste, reflow and solder ovens, soldering stations, stencils, test equipment, distribution partners and much more.
Key highlights of the event include a keynote presentation by Michael Osterman, Ph.D. from CALCE, who will enlighten attendees on "Criteria for Solder Alloy Adoption." Dr. Osterman's insights into the latest advancements in solder alloys are expected to provide valuable guidance to professionals in the field.
In addition to the keynote address, attendees will have the opportunity to attend two technical presentations:
- Denis Barbini, Ph.D., from ZESTRON, will present "Overcoming the Challenges for Implementing UPC-J-STD-0001 in Your Factory," offering practical solutions to manufacturers' implementation hurdles.
- Kunal Shah, Ph.D., from Lilotree, will share insights on "A Novel Surface Finish Can Achieve Robustness Against Copper Creep Corrosion for Better Reliability of Printed Circuit Boards," providing a fresh perspective on enhancing the reliability of electronic components.
The SMTA Capital Chapter Expo and Tech Forum promise an enriching experience for professionals in the electronics manufacturing industry. Attendees must register promptly to secure their spot at this must-attend event. To register and for more information, please visit SMTA’s website.
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