Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Green Circuits Presents Custom PCB Solutions for Satellite Assembly at Satellite 2024 Exhibition
February 19, 2024 | Green CircuitsEstimated reading time: 1 minute
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces its participation in the Satellite 2024 Conference & Exhibition, scheduled to take place March 19-21, 2024 at the Walter E. Washington Convention Center in Washington, DC. An IPC J-STD-001 certified company, Green Circuits will exhibit its pioneering Printed Circuit Board (PCB) solutions at Booth 1863, emphasizing their crucial role in advancing satellite assembly.
With over three decades of industry expertise, Green Circuits has positioned itself as a frontrunner in PCB fabrication and assembly. The company's commitment to providing high-quality design, prototyping, and specialized production services has established it as a trusted partner for OEMs globally.
One of the notable highlights of Green Circuits' showcase at the Satellite 2024 Conference & Exhibition is its contribution to satellite assembly. The company has provided unique and intricate printed circuit boards for a cubic-shaped solar-powered microsatellite. These cutting-edge PCB solutions play a pivotal role in advancing technology for space exploration.
"At Green Circuits, we are passionate about pushing the boundaries of technology and contributing to scientific advancements,” stated Green Circuits CEO Michael Hinshaw. “Our team is dedicated to supporting groundbreaking projects that have the potential to redefine our understanding of the universe.”
Attendees are invited to visit Green Circuits at Booth 1863 during the Satellite 2024 Conference & Exhibition to explore how their innovative PCB solutions contribute to the forefront of space exploration and scientific breakthroughs.
Green Circuits, Inc. provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. The company is the 2023 CIRCUITS ASSEMBLY EMS Company of the Year and Global SMT & Packaging 2023 Global Technology Award winner for Contract Manufacturers $50-100 million.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.