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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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John Mitchell Addresses Industry Workforce Challenges with U.S. Department of Commerce
February 19, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
IPC’s efforts in government relations and advocacy have been pivotal in getting legislation like the CHIPS Act passed. IPC has coined the phrase “silicon to systems” to highlight that things like chips can only function within a complete electronics system, which depends on a much broader electronics supply chain than just semiconductors. They continue to work ardently to make sure our industry’s voices are heard.
In February, IPC President and CEO Dr. John W. Mitchell was back in Washington, D.C., representing our industry in a meeting convened by the U.S. Department of Commerce, where he discussed workforce issues and how to ensure that our businesses have the workforce they need. In this audio interview, he reviews his concerns and solutions on workforce development.
Suggested Items
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
06/06/2025 | Zhen Ding TechnologyOn May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.
IMI Signs Share Purchase Agreement to Sell Its Czech Republic Manufacturing Site
06/06/2025 | IMIIntegrated Micro-Electronics Inc (IMI), through its wholly-owned subsidiary, Coöperatief IMI Europe U.A., has signed a share purchase agreement to sell 100% of the shares in IMI Czech Republic (IMI CZ) to KEBODA Deutschland GmbH & Co. KG, a subsidiary of Keboda Technology Co., Ltd. (Keboda), a publicly listed company in China.
IDC Decreases its Worldwide Smartphone Forecast to 0.6% for 2025 Amidst Uncertainty and Tariff Volatility
06/03/2025 | IDCWorldwide smartphone shipments are forecast to grow 0.6% year-over-year (YoY) in 2025 to 1.24 billion units, according to the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.