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OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

Micron Announces Business Unit Reorganization to Capitalize on AI Growth Across All Market Segments

04/23/2025 | Micron
Micron Technology, Inc., a leader in innovative memory and storage solutions, announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

STMicroelectronics Future-proofs the Development of Next-gen Cars with Innovative Memory Solution for Automotive Microcontrollers

04/22/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers, that transforms the challenging process of developing software-defined vehicles (SDV) and evolving platforms for electrification.

In-Memory Computing: Revolutionizing Data Processing for the Modern Era

04/21/2025 | Persistence Market Research
In a world where milliseconds matter, traditional computing architectures often struggle to keep up with the massive influx of real-time data.

Cadence Enables Next-Gen AI and HPC Systems with Industry’s Fastest HBM4 12.8Gbps IP Memory System Solution

04/21/2025 | Cadence Design Systems
Cadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC hardware systems.
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