Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects

12/12/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 25, 2024, and the completion of the Department’s due diligence.

SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects

12/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.

WSTS Semiconductor Market Forecast Spring 2024

11/26/2024 | WSTS
WSTS has adjusted its Spring 2024 forecast upwards, projecting a 16.0 percent growth in the global semiconductor market compared to the previous year.

sureCore Now Licensing its CryoMem Range of IP for Quantum Computing

11/26/2024 | sureCore
sureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.

HPC Customer Engages Sondrel for High End Chip Design

11/25/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in