Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Global Smartphone Market Up 1.5% in 2025 on Record Apple Shipments

12/03/2025 | IDC
Worldwide smartphone shipments are forecast to grow 1.5% year-on-year (YoY) in 2025 to 1.25 billion units, according to the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.

Memory Price Surge Squeezes Game Console Margins; 2026 Shipment Forecast Revised Downward

12/02/2025 | TrendForce
After reducing its 2026 shipment forecasts for smartphones and laptops earlier in November, TrendForce has also downgraded its 2026 forecast for game console shipments—from an initial YoY decline of 3.5% to 4.4%.

Taming AI's Hunger for Data: Using The Smallest Technology Nodes For Energy-Efficient AI

12/02/2025 | Fraunhofer
Artificial intelligence works fast, but its energy consumption is growing rapidly. A German-Taiwanese research team is now developing a solution: new memory for leading chip technologies smaller than 3 nm.

Rising Memory Prices Weigh on Consumer Markets; 2026 Smartphone and Notebook Outlook Revised Downward

11/17/2025 | TrendForce
Trendforce’s latest investigations reveal that the global macroeconomic outlook for 2026 remains weak, with geopolitical tensions and ongoing inflation continuing to dampen consumer demand.

Compal Showcases Comprehensive Data Center Solutions at 2025 OCP Global Summit

10/16/2025 | Compal Electronics Inc.
Global data centers are facing new challenges driven by AI – greater compute demand, larger working sets, and more stringent energy efficiency requirements. At this year’s OCP Global Summit, Compal Electronics presented a comprehensive vision for the data center of the future, delivering end-to-end solutions that cover compute, memory, and cooling.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in