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IMI Announces Leadership Transition and CEO Changes
February 21, 2024 | IMIEstimated reading time: 1 minute
Integrated Micro-electronics, Inc. (IMI) announces that Mr. Arthur R. Tan will no longer continue as the Corporation’s CEO after the expiration of his term on April 25, 2024.
Mr. Tan has been in the IMI leadership role for the past 22 years. He has been the driving force behind IMI’s transformation from a Philippines-based contract manufacturing company catering to largely Japanese OEMs to one of the top 25 Global EMS and top 10 Global Auto EMS players with extensive capabilities and operations serving global tier-1 and OEM customers.
At the special board meeting held on February 13, 2024, IMI’s Board of Directors approved the CEO transition plan, and identified and vetted Mr. Lou Hughes as a candidate for the role. Mr. Hughes, a highly experienced professional with extensive global C-suite experience in sales, engineering, sourcing and operations, will be nominated to succeed Art as CEO of IMI. He was previously a senior manager at General Electric, COO of Universal Electronics, a Nasdaq listed EMS company, and CEO of Beyonics, a contract manufacturer headquartered in Singapore. Subject to his appointment by the IMI Board, Mr. Hughes assumption of office will be effective on May 1, 2024.
IMI’s Board of Directors is confident that Mr. Hughes will lead IMI with the same level of dedication, innovation, and excellence that is expected by our customers and stakeholders and assures its stakeholders of IMI’s commitment to maintaining operational continuity and delivering value during this transition period. IMI will continue to uphold the highest standards of corporate governance and transparency throughout this process.
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Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.