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Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.

I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan

04/03/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights. Thirty-eighth in a series of educational technical books published by I-Connect007, this book is a guide to understanding how analyzing your factory data is the key to competitive advantage for your factory.

MacDermid Alpha Electronics Solutions’ New Book Now Available for Download

03/29/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting. 

On the Line With… Talks With Cadence Experts on Changing How PCBs Are Designed and the Role of AI

03/21/2024 | I-Connect007
In this second episode, Cadence Distinguished Engineer Taylor Hogan and Product Management Director Patrick Davis discuss the role artificial intelligence and machine learning play in intelligent system design.

On the Line With… Talks With Cadence Experts on Changing How Circuit Boards Are Designed   

02/29/2024 | I-Connect007
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, "PCB 3.0: A New Design Methodology," host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.
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