Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Embedded Capacitors for PCBs, Chips, and Packages
February 26, 2024 | Cody Stetzel, Cadence Design SystemsEstimated reading time: Less than a minute
Decoupling capacitors are the first place for systems designers to start building digital systems with sufficient power integrity. While decoupling/bypass capacitors are still a standard strategy for ensuring power integrity in single digital ASICs, the entire system power bus also needs to be approached throughout broader frequency ranges. The approach combines power integrity design at low frequencies, where discrete caps dominate, and up to GHz frequencies where discrete caps have trouble providing the required capacitance.
Package designers and chip designers assist the PCB layout engineer by including embedded capacitors on-chip and in-package to address the entire range of frequencies where decoupling is needed. As more electronics companies take a leading role in chip and package design, there is a need to determine the appropriate amount of capacitance needed to ensure low PDN impedance throughout broad frequency ranges. This article will look at the different types of capacitors that can be used as embedded components in PCBs and in chips/packages.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
Hitachi Unveils $1B U.S. Investment in Critical Grid Infrastructure
09/05/2025 | Hitachi EnergyHitachi Energy, a wholly owned subsidiary of Hitachi, Ltd., and global leader in electrification, today announced a historic investment of more than $1 billion USD to expand the production of critical electrical grid infrastructure in the United States.
Wisdom From Data-center Power Pioneer Mike Mosman
09/02/2025 | Barry Matties, I-Connect007Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.