Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
Embedded Capacitors for PCBs, Chips, and Packages
February 26, 2024 | Cody Stetzel, Cadence Design SystemsEstimated reading time: Less than a minute
Decoupling capacitors are the first place for systems designers to start building digital systems with sufficient power integrity. While decoupling/bypass capacitors are still a standard strategy for ensuring power integrity in single digital ASICs, the entire system power bus also needs to be approached throughout broader frequency ranges. The approach combines power integrity design at low frequencies, where discrete caps dominate, and up to GHz frequencies where discrete caps have trouble providing the required capacitance.
Package designers and chip designers assist the PCB layout engineer by including embedded capacitors on-chip and in-package to address the entire range of frequencies where decoupling is needed. As more electronics companies take a leading role in chip and package design, there is a need to determine the appropriate amount of capacitance needed to ensure low PDN impedance throughout broad frequency ranges. This article will look at the different types of capacitors that can be used as embedded components in PCBs and in chips/packages.
To read this entire article, which appeared in the February 2024 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
PTCRB Certification Adds New IoT Chipset Certification Category, Certifies Sony's Altair ALT1350 CTIA Certification
04/23/2025 | PRNewswireCTIA Certification announced the first PTCRB certified IoT chipset, Sony's Altair ALT1350.
Flex Wins Two 2025 PACE Awards for Innovation in Automotive Compute and Power Electronics
04/22/2025 | PRNewswireFlex was named a two-time 2025 Automotive News PACE Award winner at the awards ceremony on April 15, recognized for its industry-leading Jupiter Compute Platform and Backup DC/DC Converter design platforms.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.