Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event
February 27, 2024 | ASC SunstoneEstimated reading time: 1 minute
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.
Scheduled to take place on March 26th, the event will feature presentations from renowned experts in the field which will include John Johnson from ASC Sunstone. Topics will cover advances in UHDI design, manufacturing processes, material innovations, and reliability considerations.
As a company committed to innovation and excellence in PCB manufacturing, ASC Sunstone recognizes the importance of supporting events like this that promote industry advancement and facilitate meaningful dialogue among peers.
"We are thrilled to sponsor the SMTA UHDI event," said Anaya Vardya, CEO of ASC Sunstone. "Innovation in ultra high-density interconnects is driving significant changes in the electronics industry, and we are proud to be at the forefront of this evolution. This event provides an invaluable opportunity for professionals to come together, share insights, and collaborate on shaping the future of UHDI technology."
The event will take place at Peoria Sports Complex in Peoria, AZ, and registration is open to professionals from across the electronics manufacturing industry. Attendees can register for the event on the SMTA website at smta.org/mpage/uhdi.
Educational titles from American Standard Circuits:
- Podcast: On the Line with...ASC Sunstone, Designing for Reality
- The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
Visit I-007eBooks.com to download these and other free titles.
Share on:
Suggested Items
Altus Showcases Cutting-Edge Equipment at the Southern Manufacturing & Electronics 2025
11/12/2024 | Altus GroupAltus Group, a prominent distributor of advanced equipment for electronics assembly in the UK and Ireland, has announced its participation in the Southern Manufacturing & Electronics show, held from 4-6 February 2025 at the Farnborough International Exhibition Centre.
AIM to Present on Micro/MiniLED Applications at Hangjia Talk in Shenzhen, China
11/11/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Hangjia annual industry event focused on the future of the LED display sector.
Real Time with... SMTAI 2024: The Value of Experience in Outsourced Assembly Services
11/08/2024 | Real Time with...SMTAINolan Johnson interviews Alan Couchman, president of Process Sciences, Inc. during SMTAI 2024. Couchman discusses the opportunities and benefits to being an outsourced assembly services company based in Austin, Texas.
Real Time with... SMTAI 2024: Coating Solutions for Every Size from ECT
11/07/2024 | Real Time with...SMTAIErick Campos reviews the one-stop coatings solutions offered by ECT, ranging from coating services to equipment installation and training.
Real Time with... SMTAI 2024: SPEA Brings Added Sophistication to Board Testing Capabilities
11/05/2024 | Real Time with...SMTAILuca Fanelli describes SPEA's new AI-based optical inspection technology and shares a powerful example from the field. He also updates Nolan Johnson on SPEA's organizational growth meant to improve customer value.