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Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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StenTech’s Photo Stencil Specialized Products Division Facility Update Completed
February 27, 2024 | StenTechEstimated reading time: 1 minute
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.
"Following our growth strategy, we have invested a substantial amount of time, energy, and funds to upgrade this vital facility.” says Brent Nolan, CEO of StenTech. “Photo Stencil is the leading provider of complex electroforming precision paste, flux, ball-drop, wafer bump, and 3D stencils and screens. We offer cutting-edge products with micron-level precision and a wide range of specialized solutions, techniques, and materials not available elsewhere in North America.”
A key element of this facility upgrade is the introduction of StenTech's latest innovation in stencil coating technology – the all-new StenTech BluPrint™ CVD (Chemical Vapor Deposited) Surface Treatment. Engineered to enhance Surface Mount Technology (SMT) processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved stencil performance, longevity, and the overall quality of the SMT assembly process, streamlining production.
In the SMT industry, precise stencils and tooling are indispensable. These components demand meticulous design and prompt delivery, leaving no room for compromise on quality, speed, or reliability. Any issues or delays can lead to substantial costs in an environment where timing is paramount, and faults are expensive. StenTech's Photo Stencil Division excels in offering unmatched quality, specialized products and reliability.
“Our new brochure is now available for download and outlines the services, solutions, and exclusive coatings produced at PhotoStencil.” remarks Tony Miranda, PhotoStencil Manager.” We extend an open invitation to all interested parties to visit the facility, meet the team, and witness the high-end equipment in production.”
Now in its 25th year of operations, as StenTech embarks on the next chapter of its journey, the company remains committed to growth and innovation.
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Mycronic’s Jet Set Technology
10/02/2024 | Nolan Johnson, SMT007 MagazineIn this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
ROCKA Solutions Wins Mexico Technology Award for Innovative SMT Stencil Clean Roll
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Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
Solder Printing: SMT007 Magazine—September 2024
09/03/2024 | I-Connect007 Editorial TeamIn this issue of SMT007 Magazine, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging. Join us as we look at the latest in solder printing equipment, printable solder pastes, and the opportunities they present.