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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Sondrel Announces Two New Design Contract Wins
February 29, 2024 | SondrelEstimated reading time: 1 minute
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip. In addition, Sondrel has received new purchase orders for Design Consultancy Services from two existing customers operating in the Network processor and Edge AI Processor sectors. These purchase orders are to provide design engineering support to implement these ultra-complex designs.
Graham Curren, Sondrel’s CEO, said, “While ASIC design and supply remain at the core of Sondrel's business strategy, we continue to selectively offer our Design Consultancy Services on leading edge designs through our experienced, multi-disciplinary team of engineers. These ultra-complex chip designs need well-established teams who have the experience of working together on leading edge nodes. Sondrel is one of only a handful of design companies with highly experienced, in-house teams with all the tools and design flows in place for working at the leading edge of silicon technology.
“Sondrel has over 130 design engineers which enables it to handle several big chip projects simultaneously by forming teams with the appropriate skill sets for the particular stage of each project such as front end, back end, verification or design for test. We can pull together a team to meet the specific requirements of a customer who needs help keeping complex design projects on schedule.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.