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Sondrel Announces Two New Design Contract Wins
February 29, 2024 | SondrelEstimated reading time: 1 minute
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip. In addition, Sondrel has received new purchase orders for Design Consultancy Services from two existing customers operating in the Network processor and Edge AI Processor sectors. These purchase orders are to provide design engineering support to implement these ultra-complex designs.
Graham Curren, Sondrel’s CEO, said, “While ASIC design and supply remain at the core of Sondrel's business strategy, we continue to selectively offer our Design Consultancy Services on leading edge designs through our experienced, multi-disciplinary team of engineers. These ultra-complex chip designs need well-established teams who have the experience of working together on leading edge nodes. Sondrel is one of only a handful of design companies with highly experienced, in-house teams with all the tools and design flows in place for working at the leading edge of silicon technology.
“Sondrel has over 130 design engineers which enables it to handle several big chip projects simultaneously by forming teams with the appropriate skill sets for the particular stage of each project such as front end, back end, verification or design for test. We can pull together a team to meet the specific requirements of a customer who needs help keeping complex design projects on schedule.”
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Sweeney Ng - CEE PCBSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.