-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies
February 29, 2024 | IPCEstimated reading time: 2 minutes
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
“IPC applauds this very important milestone in the work to build a more resilient semiconductor manufacturing supply chain in North America,” said Richard Cappetto, Senior Director of North American Relations at IPC. “Today’s action is a welcome milestone following years of education and advocacy work by IPC and our partners. It will help ensure that the United States can bridge current gaps in its semiconductor supply chain and position itself to be a leader in the global marketplace with the ability to manufacture cutting-edge technologies.”
Advanced packaging is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is key to U.S. semiconductor leadership, and industry leaders call advanced packaging the “new king” of innovation in the chips sector.
The NOFO makes $300 million available for multiple awards of up to $100 million each for up to five years. Investments will be focused on projects that achieve ambitious targets for one or more of the program’s chief objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
IPC is the leading advocate for a “silicon-to-systems” approach to the CHIPS and Science Act, recognizing the importance of silicon fabrication but also the need for related electronics manufacturing capabilities—including advanced packaging, printed circuit boards (PCBs), and IC substrates.
IPC’s influential 2021 report, North American Advanced Packaging Ecosystem Gap Assessment, found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. That report was referenced both in today's NOFO and in the CHIPS Office’s guiding document for the National Advanced Packaging Manufacturing Program. An IPC Symposium on Advanced Packaging in 2022 also helped propel government action.
For more information, visit www.ipc.org/solutions/ipc-advanced-packaging-technology.
Suggested Items
L3Harris Equips New German H145M Helicopters with High-Performance Imaging Capabilities
12/10/2024 | L3Harris TechnologiesL3Harris Technologies is providing WESCAM MX™-15D electro-optical/infrared sensor systems to Airbus Helicopters for the German armed forces and its new fleet of multi-role H145M helicopters.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
L3Harris Awarded Grants for New Buildings in Florida
12/09/2024 | L3Harris TechnologiesL3Harris Technologies has negotiated a High Impact Business Performance (HIPI) grant for $2 million from the state of Florida. The HIPI, an incentive used to attract and grow major facilities, provides an allocation of $1 million in 2025 and $1 million in 2027 for the company’s two new facilities in Palm Bay, Florida.
Regal Rexnord, Honeywell To Collaborate On Solutions For Advanced Aircraft Mobility And eVTOL Markets
12/09/2024 | HoneywellRegal Rexnord Corporation and Honeywell announced that the two companies have entered into a multi-year collaboration to build technologies for the emerging Advanced Air Mobility (AAM) market and be installed on Electric Vertical Take-Off and Landing (eVTOL) aircraft.
RTX's Raytheon Awarded $590M Production Contract for Next Generation Jammer Mid-Band
12/09/2024 | Raytheon CompanyRaytheon, an RTX business, has been awarded a $590 million follow-on production contract from the U.S. Navy for the Next Generation Jammer Mid-Band (NGJ-MB) system.