-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Reassessing Surface Finish Performance for Next-gen Technology, Part 2
March 4, 2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.Estimated reading time: 1 minute
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.
It has previously been shown that the low conductivity and magnetic properties of the electroless nickel (EN) layer negatively affect electrical signals as they travel along the conductor’s outer surfaces, leading to insertion losses. Subsequent studies show that reducing the EN thickness can offset some insertion losses observed. In more recent times, nickel-free finishes, such as EPIG (electroless palladium, immersion gold, no EN), thin EN ENEPIG, silver-gold (immersion silver followed by immersion gold), have been promoted as solutions for improving signal integrity at higher frequencies.
In Part 1 of this article, we reported the signal loss properties of the new nickel-free surface finishes, along with immersion silver, organic solderability preservative (OSP), and ENIG/ENEPIG surface finishes. As expected, ENIG and ENEPIG are challenged by signal losses at higher frequency, with OSP and immersion silver demonstrating no contribution to the signal losses. The new generation surface finishes (silver-gold, thin EN ENEPIG, and EPIG) perform similarly—outperforming standard ENIG/ENEPIG finishes but still contributing slight signal loss compared to immersion silver and OSP.
One of the concerns for nickel-free finishes is the solder joint reliability with removed or greatly reduced nickel diffusion barrier layer thickness. Part 2 of this article addresses this concern and focuses on various solder joint reliability testing, including high-speed ball shear, drop shock, and solder joint reliability electromigration tests.
This is an excerpt from the February 2024 issue of Design007 Magazine, continue reading.
Suggested Items
Indium Experts to Present Advanced Research at International Symposium on Microelectronics
09/20/2024 | IndiumIndium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
09/04/2024 | I-Connect007Don't miss the latest episode of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Real Time with… IPC APEX EXPO 2024: Exploring the Future of Surface Finishes
04/25/2024 | Real Time with...IPC APEX EXPOJoe McGurran, product marketing director for MKS Atotech, looks into the future of surface finishes, discussing less nickel, reduced thickness, technologies influencing HDI and UHDI, and the benefits of nickel-free surface finishes. He also touches on popular finishes like ENIG and palladium immersion gold and discusses the value proposition of making a change.
All Flex Solutions Invests in New Flexible Circuit Facility
02/05/2024 | All Flex SolutionsAll Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
ITRI, Intel Taiwan Unveil Cutting-Edge Joint Lab for HPC Cooling Certification
02/01/2024 | ITRIITRI and Intel Taiwan have inaugurated the ITRI-Intel Joint Lab for HPC Cooling Certification. This facility is dedicated to the development and validation of industrial immersion cooling solutions for high-performance computing.