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As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced gallium-based materials. Designed for both TIM¹ and TIM² applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability. Liquid metal TIMs offer:
- High thermal conductivity versus polymers
- High purity enables excellent wetting to surfaces
- No soldering or surface metallization needed
Indium Corporation’s Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices. Indium has a high bulk thermal conductivity (86 W/m-K) which means less sensitivity to bond line thicknesses and coplanarity issues compared to polymeric TIMs. Indium’s ductility can accommodate differential thermal expansion with minimal stress on the interface making Solder TIM an ideal TIM1 or TIM1.5 where die or substrate warpage and CTE mismatch challenges are present.
Indium Corporation’s Heat-Spring® solutions provide an optimal TIM2 solution as a compressible, non-reflow metal TIM. In liquid immersion systems, Heat-Spring® is also a proven TIM compatible with all major immersion fluids that will not dissolve in Single–Phase or Two-Phase immersion cooling liquids. These indium-based TIMs deliver outstanding thermal conductivity compared to non-metal alternatives—with pure indium metal achieving 86 W/m·K in all directions. Due to its solid metal state, Heat-Spring® effectively prevents pump-out and bake-out issues while also supporting sustainability through Indium Corporation’s reclaim and recycle program.
