Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat

04/13/2026 | Boeing
Boeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.

THEON Signs Strategic Agreement with RHEINMETALL

04/09/2026 | Globe Newswire
Theon Sensors SA, a fully owned subsidiary of Theon International Plc (THEON) , has signed a strategic agreement with Rheinmetall Electronics GmbH (RHEINMETALL) for the development, qualification and serial supply of a stabilized multi-sensor electro-optic system based on THEON’s latest PHYLAX technology, marking an important milestone in THEON’s expansion into advanced electro-optical solutions for modern combat vehicles.

Seaward Automation Announces Command™ Collaboration with Robosys

04/08/2026 | Seaward Automation
Seaward Automation, in partnership with Robosys Automation, announced the launch of enhanced functionality for its Command™ software platform at the Palm Beach International Boat Show, introducing integrated Remote Command and Autonomous Navigation capabilities powered by Robosys Automation’s VOYAGER AI.

Foxconn Showcases SmartCity Platform at Taipei Exhibition

03/19/2026 | Foxconn
Foxconn Technology Group announced its participation in the "2026 Taipei Smart City Show & Net Zero City Show".

Teradyne Introduces Omnyx: Redefining Board Test for the AI Era

03/17/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced the launch of Omnyx, a groundbreaking manufacturing test platform for printed circuit board assemblies (PCBA) and sub-assemblies, engineered to meet the unique test requirements of AI and data centers.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in