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Advanced Electronics Packaging Digest

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TTM Technologies Reports Q2 2026 Results; New Sales Up 37%

08/06/2026 | TTM Technologies
TTM Technologies, Inc., a leading global manufacturer of technology products, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards (PCBs) and substrates, today reported results for the second quarter of 2026, which ended on June 29, 2026. 

Flexible Circuit Technologies (FCT) Welcomes Mark Duarte as Director of Global Business Development

08/05/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc.(FCT) a flexible, printed circuit, and advanced electronics manufacturer, is pleased to announce that Mark Duarte has joined the company as Director of Global Business Development, Printed Electronics. 

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

Fujitsu, Monash and CSIRO Strengthen Australia–Japan Quantum Partnership

08/04/2026 | Fujitsu
Australian researchers and students will gain access to advanced quantum computing technology under a Memorandum of Understanding between global digital transformation leader, Fujitsu, Monash University, and Australia’s national science agency, CSIRO.

LITEON Invests in DenseLight to Strengthen Optical Communications for AI Infrastructure

08/04/2026 | LITEON Technology
LITEON Technology announced a strategic investment in DenseLight Photonics, a provider of indium phosphide (InP) optical communication components through its Singapore-based operating subsidiary, with a total transaction value of US$34.3 million.
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