Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Department of Defense to Expand Manufacturing of PCBA for Hypersonic Weapons
March 11, 2024 | U.S. DoDEstimated reading time: 1 minute
The Department of Defense announced an award of $11.7 million via the Defense Production Act Investment (DPAI) Program to Ensign-Bickford Aerospace & Defense (EBAD) that will provide additional printed circuit board assembly (PCBA) production capacity at their Simsbury, CT location. EBAD will increase existing capacity and manufacturing processes to reduce cost and accelerate PCBA production.
“This effort is a key component of the DoD’s strategy to accelerate the development and fielding of hypersonic systems and deliver cutting-edge capabilities to our armed forces,” said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. “This award also represents another investment in domestic manufacturing in accordance with the National Defense Industrial Strategy to help build a modernized defense industrial ecosystem.”
EBAD applies state-of-the-art manufacturing technology to achieve these goals while continuing to meet weapon system requirements. These processes are proven to enable rapid prototyping and significant cost reduction.
This is the latest of 11 awards made by the DPAI program across multiple areas totaling $300 million since the beginning of Fiscal Year 2024. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Prioritization (MCEIP) Directorate, in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.
Share on:
Suggested Items
Navigating Change, Mitigating Risk: We’ve Been Here Before
04/22/2025 | Marcy LaRont, PCB007 MagazineI visited with Tom Edman, president and CEO of TTM Technologies, and chair of the IPC Board of Directors. Tom candidly shares his insights into the implications of changes on the defense sector and the broader electronics manufacturing industry, especially concerning PCB manufacturing. With half of TTM’s business tied to defense, Tom discusses the potential opportunities and challenges arising from government initiatives, tariffs, and supply chain complexities.
RTX's Lower Tier Air and Missile Defense Sensor Positioned for Production
04/21/2025 | RTXRaytheon, an RTX business, is transitioning to production of its Lower Tier Air and Missile Defense Sensor, or LTAMDS, after completing the U.S. Army's rigorous flight test program and achieving the Department of Defense's Major Capability Acquisition Milestone C designation.
Neways Firmly Expands Defense Business
04/21/2025 | NewaysNeways Electronics, the global innovator in mission-critical electronics, foresees very strong growth in its defense-related activities in the near term.
L3Harris Expands Indiana Facility to Support America’s Golden Dome
04/18/2025 | L3Harris TechnologiesL3Harris Technologies has completed a $125 million expansion at its space manufacturing facility in Fort Wayne to support the Department of Defense’s urgent need for on-orbit technology to defend the homeland by building a “Golden Dome” around the United States.
Safran Inaugurates Advanced Manufacturing and Engineering Hub in Colorado to Propel Innovation in Satellite Propulsion
04/17/2025 | PRNewswireJoe Bogosian, CEO of Safran Defense & Space, Inc. (Safran DSI), and Pier Roviera, President of Space Solutions at Safran DSI, inaugurated the company's new manufacturing facility in Parker, Colorado, on April 11.