Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
March 12, 2024 | JCN NewswireEstimated reading time: 1 minute
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.
AuRoFUSE™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low temperatures. Using AuRoFUSE™ preforms (dried paste forms), this technology can reach 4 μm fine-pitch mounting with 20 μm bumps. Formed through a thermocompression bonding process (20 MPa at 200°C for 10 seconds), AuRoFUSE™ preforms exhibit compression of approximately 10% in the compressive direction while showing minimal deformation in the horizontal direction. This gives them sufficient bonding strength1 for practical applications, making them suitable for use as gold bumps. With the main component being gold, which has a high level of chemical stability, AuRoFUSE™ preforms also provide excellent reliability after mounting.
This technology enables miniaturization of semiconductor wiring and greater integration (higher density) for various types of chips. It is expected to contribute to the high-level technical innovation required of advanced technologies, including optical devices such as light-emitting diodes (LEDs) and semiconductor lasers (LDs), and use in digital devices such as personal computers, smartphones, and in-vehicle components.
TANAKA will actively distribute samples of this technology in the future to promote greater awareness in the marketplace.
Share on:
Suggested Items
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Panel Driver IC Price Decline Slows in 1H25; Gold Prices, China Subsidies, and U.S.-China Tariffs Emerge as Key Variables
04/28/2025 | TrendForceTrendForce’s latest investigation finds that China’s subsidy policies and rising concerns over reciprocal tariffs are reshaping brand strategies in the panel market, indirectly influencing price trends for panel driver ICs.
L3Harris Expands Indiana Facility to Support America’s Golden Dome
04/18/2025 | L3Harris TechnologiesL3Harris Technologies has completed a $125 million expansion at its space manufacturing facility in Fort Wayne to support the Department of Defense’s urgent need for on-orbit technology to defend the homeland by building a “Golden Dome” around the United States.
Observations on Palladium as a Final Finish
04/04/2025 | Happy Holden, I-Connect007Not much has been published about palladium as a final finish, but it’s experiencing a renaissance as a liquid metal for metallization of copper in ultra HDI and as a final finish. It was very popular in the 1970s because of its corrosion resistance, as the only other final finishes were tin-lead reflow, Ni/Au, OSP, or immersion tin. Palladium was very popular with the automotive industry then and Photocircuits of Glen Cove, New York, was a major supplier of boards.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.