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Data I/O to Showcase Automated Pre-placement Device Programming and Security Provisioning Solutions for the Connected Factory at IPC APEX EXPO 2024
March 12, 2024 | Data I/O CorporationEstimated reading time: 1 minute
Data I/O Corporation, the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will showcase device programming and security provisioning solutions delivering high-performance, configuration flexibility automated device programming systems with security provisioning and industry 4.0 integration capability to enable traceability, process analysis and two-way communication that improves factory efficiency and quality at the lowest total cost of ownership.
Data I/O will demonstrate a 64% increase in programming performance on Lumen®X Programmers with VerifyBoost™, the PSV family automated device programming systems, SentriX® security provisioning platform and the ConneX® software application that enables Data I/O’s device programming systems to integrate into the connected factory at the IPC APEX Expo in booth #3107 in Anaheim, California from April 9th – 11th at the Anaheim Convention Center.
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Advent Diamond, Northrop Grumman Set Record for Diamond-Based Solid-State Limiters
05/06/2026 | PRNewswireAdvent Diamond Inc. and Northrop Grumman have set a new performance record for solid state limiters made from engineered diamond. The device successfully handled more than 100 Watts of power while providing reliable protection for projected radio frequency (RF) applications.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
05/04/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Zhen Ding Recognized with Dual 'A' Ratings by CDP
04/16/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leader in the PCB industry, received the highest “A” rating in both Climate Change and Water Security in the 2025 CDP assessment.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Fuse Expands U.S. Radiation Testing Capacity with New Albuquerque Facility
04/13/2026 | PRNewswireFuse, a leading U.S.-based fusion company, announced the establishment of a new state-of-the-art facility in Albuquerque, New Mexico that will expand U.S. radiation effects testing capacity for critical defense, space, and semiconductor technologies.