StenTech to Unveil Cutting-Edge StenTech BluPrint™ CVD Surface Treatment at 2024 IPC APEX EXPO
March 12, 2024 | StenTechEstimated reading time: 1 minute

StenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO. This groundbreaking technology, designed to enhance SMT processes with unparalleled benefits for stencil performance, longevity, and overall assembly quality, will be showcased for the first time in Booth 1608 from April 9-11, 2024 at the Anaheim Convention Center in California.
The relentless drive to shrink components and circuit boards poses challenges in solder paste printing with laser-cut stainless-steel stencils. StenTech BluPrint™ CVD emerges as the premier solution in North America, aligning with the intricate demands of the semiconductor and EMS industry, backed by cutting-edge laser technology advancements.
StenTech BluPrint™ CVD Surface Treatment introduces a revolutionary method of depositing thin films onto a substrate by introducing chemical precursors into a reactor chamber, resulting in a solid material deposit on the surface. The consistency achieved across all areas distinguishes StenTech's CVD from traditional liquid spray processes, providing a resilient, virtually indestructible coating that ensures uniform printing with identical apertures.
Beyond consistent thickness, StenTech BluPrint™ offers exceptional thermal stability, chemical inertness, anti-stiction properties, a refined smooth surface finish, customizable characteristics, and unmatched print quality consistency. The process begins with plasma polishing, followed by the chemical vapor deposition, resulting in a smoother sidewall and enhanced corrosion resistance.
StenTech BluPrint™ stands out with its application at approximately 1000 times less thickness compared to existing alternatives, ranging from 3-5 micrometers versus 3 nanometers. Positioned as the practical choice for coating high-end SMT solder paste stencils, StenTech BluPrint™ promises noticeable enhancements in transfer efficiency, outperforming current nano-coatings, particularly in high-volume builds.
StenTech invites attendees to Booth 1608 at the 2024 IPC APEX EXPO to explore the StenTech BluPrint™ CVD Surface Treatment and experience firsthand its transformative impact on SMT processes.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
KYZEN to Highlight High-Reliability MICRONOX Chemistries at SEMICON West 2025
09/08/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona.