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Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
March 12, 2024 | Apollo SeikoEstimated reading time: 1 minute
Apollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. The company will present a lineup of five innovative induction, laser, selective & contact soldering systems, including the award-winning J-CAT Wave. This induction heating (IH) soldering robot revolutionizes the soldering landscape with its non-contact and localized heating capabilities.
The J-CAT Wave utilizes a groundbreaking magnetic concentrating technology, enabling localized self-heating for quick and efficient soldering, even in applications with substantial heat sinks. The IH heating system ensures a safer soldering environment, and its non-contact approach minimizes operational costs, offering a compelling advantage for modern manufacturing.
Key Features of J-CAT Wave:
- Non-contact & Local Heating: The IH soldering robot ensures precision with its non-contact and localized heating mechanism.
- Low Running Cost: With efficient heating and reduced operational costs, the J-CAT Wave stands out for its cost-effectiveness.
- Safer Soldering Environment: Prioritizing safety, this system creates a safe soldering environment for diverse applications.
- Simple Control: The J-CAT Wave is designed for user-friendly operation, providing simplicity without compromising on performance.
Apollo Seiko invites attendees to Booth 1408 at the 2024 IPC APEX EXPO to explore its cutting-edge soldering solutions and witness firsthand the unmatched capabilities of the J-CAT Wave. Join us for an exciting showcase of innovation that promises to redefine the future of soldering technology.
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A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
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Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.