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Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
March 12, 2024 | Apollo SeikoEstimated reading time: 1 minute
Apollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. The company will present a lineup of five innovative induction, laser, selective & contact soldering systems, including the award-winning J-CAT Wave. This induction heating (IH) soldering robot revolutionizes the soldering landscape with its non-contact and localized heating capabilities.
The J-CAT Wave utilizes a groundbreaking magnetic concentrating technology, enabling localized self-heating for quick and efficient soldering, even in applications with substantial heat sinks. The IH heating system ensures a safer soldering environment, and its non-contact approach minimizes operational costs, offering a compelling advantage for modern manufacturing.
Key Features of J-CAT Wave:
- Non-contact & Local Heating: The IH soldering robot ensures precision with its non-contact and localized heating mechanism.
- Low Running Cost: With efficient heating and reduced operational costs, the J-CAT Wave stands out for its cost-effectiveness.
- Safer Soldering Environment: Prioritizing safety, this system creates a safe soldering environment for diverse applications.
- Simple Control: The J-CAT Wave is designed for user-friendly operation, providing simplicity without compromising on performance.
Apollo Seiko invites attendees to Booth 1408 at the 2024 IPC APEX EXPO to explore its cutting-edge soldering solutions and witness firsthand the unmatched capabilities of the J-CAT Wave. Join us for an exciting showcase of innovation that promises to redefine the future of soldering technology.
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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
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Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
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