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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Intervala Partners with U.S. Navy Talent Pipeline Program
March 20, 2024 | IntervalaEstimated reading time: Less than a minute
Intervala recently became an employer partner with the Talent Pipeline Program (TPP), a program created by the U.S. Navy to increase awareness of the hundreds of thousands of skilled manufacturing jobs that will need to be filled over the next several years and to help manufacturers like Intervala hire, train and retain talented workers.
On March 15, several Intervala team members attended a Pittsburgh Technology Council-hosted networking and recruiting event supporting the program. It was great meeting other local TPP employer partners, and we look forward to our company, employees and customers benefiting from Intervala’s participation in the program.
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SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
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SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized
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