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The ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.
Session 1: Advanced Packaging
From 8:30 to 11 a.m., IPC Chief Technology Officer Matt Kelly will provide the latest insights from industry experts on next-generation IC substrate and UHDI needs for next-generation advanced packages. Application workloads (including AI), high-performance computing, and 5G/6G wireless communications, among others, drive the need for faster, higher bandwidth, more powerful processors, and more memory. Significant changes in semiconductor architectures and designs using chiplet-based, heterogeneous integration approaches are well underway. These changes directly impact IC substrates that interconnect directly with semiconductor chips and UHDI-printed circuit boards needed to connect the electronic package to the rest of the system.
Please join us for this important session that will provide a big picture of the needs for next-generation substrates, insights on the challenges of fabricating UHDI PCBs vs. IC substrates, discussion on next-generation organic build-up substrate advancements, and future substrate R&D needs and challenges. Additional speakers representing companies such as Intel, AT&S, Resonac, AMKOR, and Dia Nippon Printing will dive deeper into these important issues.
Session 2: EV Electronics/E-mobility
From 11:30 a.m. to 2 p.m., the topic is “EV Electronics: Design, Manufacturing, and Reliability Challenges.” It will include two topical sessions selected by a Technical Program Committee of EV industry experts chaired by Dr. Stanton Rak.
The first session, “PCBA Reliability and Test for EV Applications,” will be moderated by Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions. Topics will include high-voltage test and reliability, solder and Ag-sintering material reliability, high-voltage PCB failure mechanisms, and testing protection materials.
Dr. Udo Welzel, senior expert at Robert Bosch GmbH, will moderate the second topical session, “EV Power Electronics Design and Manufacturability.” Speakers representing companies such as Semikron Danfoss, Robert Bosch, Zestron, Indium Corporation, MiroTek, and TRUMPF will deliver brief technical presentations followed by a panel discussion with audience participation. Topics include high current and high voltage connections with PCB, laser welding for busbars, power electronics, and more. The e-mobility session is supported by IPC’s e-Mobility Quality & Reliability Advisory Council, and closely aligns with the council’s mission to help deliver e-mobility quality, reliability and safety while protecting the drive for innovation.
“On behalf of the TPC, I invite you to attend Thursday’s Special Sessions, built for conference attendees to learn from and network with industry leaders,” Kelly says. “Amazing things are happening in electronic packaging and eMobility applications. We are delighted to bring you strong, high-quality technical insights shaping the future of electronics manufacturing.”
Plan your travel accordingly to attend these exciting Thursday morning sessions. Flexible registration options allow attendees to attend these Thursday sessions by selecting the option that works best with their schedules: These Special Sessions will be included in the following registration packages: “All-Access,” “World Convention,” “Committee Meetings Plus Conference,” and the “Full Technical Conference.” Other attendees may wish to register for one or both Special Sessions using the “Technical Conference Single Session Pass” option.
Julia Gumminger is the manager of professional development and events for IPC.
This article appeared in the March 2024 issue of SMT007 Magazine.
