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SMTA Europe Announces 2024 Spring Conferences
March 22, 2024 | SMTAEstimated reading time: 1 minute
The SMTA announces three conferences taking place in Europe this spring..
The Advanced Electronics Assembly Conference (AEAC) will co-locate with InnoElectro, 24 April 2024 in Budapest, Hungary. This strategic venue selection promises greater exposure, a larger audience, and the opportunity to attract high-quality attendees. Visit the conference website here: https://smta.org/aeac
County Clare, Ireland, is the location of the Advanced Manufacturing Conference and Line Tour on 9 May 2024. The conference will feature three distinct sessions covering Product Management, Advanced Manufacturing, and Sustainability. A tour of the Ei Electronics manufacturing facility is planned for the afternoon.
The following week the Electronics in Harsh Environments Conference takes place 14-16 May 2024 at the Technical University of Denmark in Copenhagen. This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments and power electronics. Keynote presentations and professional development courses are featured each day of the event and included in conference registration. Details can be found on the conference website.
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Brent Fischthal - Koh YoungSuggested Items
A Necessary Shift From Gerber to IPC-2581
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Microchip Expands Post-Quantum Root of Trust Controllers
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Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
TRI Launches New Wafer Inspection and Metrology Platform
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