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Intraratio Enhances MES + Yield / IoT Management with New Advanced Manufacturing Analytics
March 22, 2024 | IntraratioEstimated reading time: 1 minute
Intraratio announced AICard, which harnesses the power of artificial intelligence and machine learning to empower manufacturers to make informed decisions quickly and accurately regarding product quality and manufacturing line performance and optimization.
“We are proud to formally release AICard into the advanced electronics manufacturing market, for real-time automated AI/ML outlier detection, bringing a massive competitive advantage to our customers,” said Ryan Gamble, CEO and Founder of Intraratio. “AICard is accessible and rapidly deployable today, regardless of customer size. This is in direct contrast to existing solutions in the market today that are nothing more than costly data science experiments, often resulting in pilot purgatory. Our solution immediately optimizes workforce utilization, by automating out the data mining phases of both exception identification and cataloging the source, in order to provide engineering and management with insights that drive immediate process improvements.”
Manufacturing companies frequently encounter the challenge of collecting and analyzing large amounts of data to pinpoint product defects, inefficiencies, and areas for improvement. AICard's most noteworthy aspect is its advanced automation, which rapidly identifies and reports anomalies in real-time.
This groundbreaking capability provides manufacturers with a comprehensive view of outlier data for their products, streamlining critical decision-making processes. Unlike traditional methods that rely on manual model creation and upkeep, AICard automates these tasks, freeing up valuable time for users to delve into data analysis rather than collection. Additionally, AICard seamlessly integrates with our RC/DC data schemas, allowing users to analyze and report data without the hassle of managing extra data pipelines.
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FTG Achieves Major Milestone with TCCA Certification for Edge+ on Boeing 737NG Family
05/16/2025 | Globe NewswireFiran Technology Group Corporation (FTG) announced that its FLYHT subsidiary has been awarded a Supplemental Type Certificate (STC) by Transport Canada Civil Aviation (TCCA) for the AFIRS Edge+™ product on the Boeing 737NG family of aircraft.
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRECorning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.
Breaking Down Barriers: The Connectivity of Machines in SMT Production Lines
05/14/2025 | Bill Cardoso, Creative ElectronAs the world increasingly moves toward erecting trade barriers, we find ourselves in a paradox. Across the globe, the rise in tariffs and protectionist policies is creating a more fragmented global economy, with nations seeking to insulate themselves from external economic pressures. However, within the confines of the SMT production line, the trend is moving in precisely the opposite direction—toward greater connectivity, integration, and collaboration. Rather than isolating one machine from another, SMT production lines are increasingly interconnected, with data being shared across various stages of the process to improve quality, efficiency, and defect detection.
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
05/14/2025 | John Watson -- Column: Elementary, Mr. WatsonI've often been asked, "Can you have a perfect PCB design?" At first blush, it seems like the answer should be yes. After all, if you follow all the rules, double-check your work, and use the right tools, it should be perfect. Right?
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.