-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
March 29, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MacDermid Alpha Electronics Solutions. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
Peer Reviewer Dr. Helmut Schweigart, from Zestron Europe, offered his recommendation of the book, stating, “Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. Turner is always conscious of the need for sustainability when it comes to the encapsulation of electronic assemblies.”
Download your free copy today at I-Connect007.com/ese.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
Suggested Items
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
PCB Designers: Enhance Your Listening Experience With New Companion Download to the DFR Podcast Series
11/11/2024 | I-Connect007Exciting news for listeners of On the Line With... Designing for Reality, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from ASC Sunstone’s expert Matt Stevenson is now available for download.
U.S. Army Awards RTX's Raytheon TOW Contracts for $676 Million
10/24/2024 | RTXRaytheon, an RTX business, was awarded $676 million to continue manufacturing the tube-launched, optically-tracked, wireless-guided TOW® weapon system for the U.S. Army.