Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

AT&S Announces Early Redemption of 2022 Hybrid Bond

10/12/2026 | AT&S
AT&S will redeem its outstanding 2022 hybrid bond with a nominal amount of €350 million on 22 October 2026, the first available call date.

FCT Introduces Liquid Leak Detection Flex Assembly for AI and High-Performance Computing Systems

09/21/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc. (FCT) is pleased to announce the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.

LITEON Announces Strategic Investment in Liquid Cooling Technology Company DCX

09/03/2026 | BUSINESS WIRE
LITEON Technology announced a strategic investment in DCX POLSKA Sp. z o.o., a Warsaw, Poland-based provider of advanced liquid cooling systems for AI and High-Performance Computing (HPC) data centers.

Liquid Cooling to Reach 53% of High-End AI Infrastructure in 2026

08/17/2026 | TrendForce
According to TrendForce’s latest AI server industry research, continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed the TDP of individual chips above 1 kW.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in