Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
The Delicate Balance of Sustainable Business and Going Green
March 25, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Alex Stepinski is known throughout the industry as an innovator and disruptor committed to environmental sustainability, primarily through his current work around zero liquid discharge (ZLD) for PCB fabrication. But Alex says financial sustainability must come first. Standing firm in his belief that green is the most financially sustainable option for manufacturing and financial success, he explains his position and vision for a greener, more lucrative future for bare board fabricators. “Before I retire in about 10 years,” he says, “I want to make sure that all new fabs, and at least 25% of the old ones are zero liquid discharge in this industry.”
Nolan Johnson: Alex, what are the biggest technological and cost challenges for zero liquid discharge?
Alex Stepinski: Globally, the single biggest challenge of ZLD is the economics, but overall, there are three distinct technical challenges. The first is how to reduce the amount of liquid chemicals you have to boil, which is the biggest cost. Next, it’s about how to treat the portfolio of organic compounds cost-efficiently. Third, you must have a way to deal with mistakes, such as when the wrong chemistry is dumped into the wrong place—something that happens in every shop.
Zero liquid discharge in Europe is primarily done by concentrating the waste and then shipping it out to central facilities where the liquid is boiled off at scale. They have a different ecosystem. Because we don’t have this ecosystem in place in the U.S. yet, I originally took this concept when I worked in New Hampshire and purchased boiling units normally used in European centralized treatment facilities and put them into some of the new fab shops. Boiling chemistry is the biggest cost driver in this system. Through my travels and due diligence, I often extract ideas from other industries, and my most recent significant process discovery provides a nearly 95% reduction in the chemical boiling cost for ZLD.
To read this entire conversation, which appeared in the March 2024 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Jabil Introduces New High-Performance, Purpose-Built AMD and Intel Servers Optimized for AI, FinTech, and Cloud Applications
10/14/2024 | BUSINESS WIREJabil Inc. announced that it is expanding its server portfolio with the J421E-S and J422-S servers, powered by AMD 5th Generation EPYC™ and Intel® Xeon® 6 processors.
Jabil Acquires Mikros Technologies
10/03/2024 | BUSINESS WIREJabil Inc., a global leader in design, manufacturing, and supply chain solutions, announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,
09/23/2024 | TrendForceTrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.
NVIDIA Blackwell's High Power Consumption Drives Cooling Demands; Liquid Cooling Penetration Expected to Reach 10% by Late 2024
07/30/2024 | TrendForceWith the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024.