-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
March 26, 2024 | ITW EAEEstimated reading time: 1 minute
ITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Recipients are selected by an independent panel of practicing industry engineers. ITW EAE will be showcasing the Deep Wave option on the Electrovert Wave Soldering Machine at IPC APEX booth 2327 through Thursday, April 11, 2024, in Anaheim.
A major market trend is that PCB designs continue to increase in complexity and cost. Board assembly manufacturers therefore rely on equipment suppliers to innovate options providing increased performance and capabilities. An area of attention pertaining to high density/high value plated-through-hole (PTH) board assembly designs is the use of wave soldering to maximize throughput and optimize soldering results.
The Deep Wave option overcomes the challenges associated with deep pockets and masking and provides a wave depth necessary to achieve topside hole fill. In some applications the 20 mm capability has removed the need for an additional soldering process. The Deep Wave option is a recipe-controlled parameter in the machine software that can make changes between different wave heights within 10 seconds. The Deep Wave option complements other Electrovert value added options including ExactaWave (automatic wave height adjustment), adjustable wave pump RPM’s settings, forced convection blower speed adjustments and precision selective fluxing that can all be adjusted on-the-fly.
We are very proud to be recognized with the NPI award for this innovative technology,” said Greg Calvo, ITW EAE Wave Soldering Business Manager. “Electrovert’s Deep Wave solution to increasing wave height for increased capability provides many benefits to manufacturers that value production line throughput, maximum soldering performance quality, and flexibility in demanding production environments.”
Suggested Items
Nano Labs Invests in AI ASIC Chip Startup, Collaborating with DeepSeek to Drive the Future of AI Technology
01/28/2025 | PRNewswireNano Labs Ltd., a leading fabless integrated circuit design company and product solution provider in China, today announced its strategic investment in Hangzhou Weiheng Technology Co., Ltd., obtaining a 5% stake in the company.
Beyond Design: Electro-optical Circuit Boards
01/22/2025 | Barry Olney -- Column: Beyond DesignPredicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
Honeywell, Sino Jet Expand Collaboration With New Memorandum Of Understanding
12/17/2024 | HoneywellHoneywell announced that it has signed a memorandum of understanding (MoU) with Sino Jet at the Middle East and North Africa Business Aviation Association (MEBAA) show.
Dymax to Showcase Innovative Adhesives at COMPAMED 2024
11/08/2024 | DymaxDymax, a leading manufacturer of rapid curing materials and equipment, will showcase its latest developments in medical technology at this year’s COMPAMED in Düsseldorf, from November 11 to 14, in Hall 8B, Booth L01.
Aspocomp to Showcase Expertise at European Microwave Exhibition
09/16/2024 | AspocompAspocomp, a leading provider of advanced printed circuit board (PCB) solutions, is excited to announce its participation at the European Microwave Exhibition (EuMW) 2024.