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Who Really Designs the PCB?

09/10/2026 | Stephen V. Chavez, Siemens EDA and PCEA
“Who designs the PCB?” sounds like a simple question, but it assumes there’s a simple answer. In reality, every discipline involved in product development, from electrical and mechanical engineering to manufacturing and procurement, has a hand in designing the PCB. Today’s products are created through constant collaboration among multiple engineering disciplines, each influencing decisions that affect performance, manufacturability, cost, and reliability. The PCB designer has not simply gained access to better tools, more automation, and/or sophisticated design methodologies.

Real Time with... THECA 2026: Thailand's Electronics Industry Growth and Challenges

09/10/2026 | Real Time with... THECA
Expressing pride in this year's THECA event and some of the challenges encountered in putting together the important event, Phutana Daoruang, general manager of THPCA, discusses the rapid growth of Thailand's PCB, EMS, and chip packaging industries and the critical workforce shortage. He also outlines strategic initiatives to address these challenges and foster industry development.

PCBAA: Backpedaling on Requirement to get Chinese Printed Circuit Boards out of the Defense Industrial Base is Unacceptable

09/09/2026 | PCBAA
Five years ago, Congress provided guidance to the Pentagon to create a plan to remove Chinese, Russian, Iranian, and North Korean content from critical defense supply chains: certainly adequate time for this important work to be done.

FKN Systek Introduces Two-Stage Depaneling for Thin Aluminum Panels

09/04/2026 | FKN Systek
FKN Systek, a U.S.-based manufacturer of PCB depaneling equipment and tooling, has introduced a two-stage depaneling process designed to prevent warping in thin, V-scored aluminum panels.

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.
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