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Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
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As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
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The IMAPS Show: A Conversation with John Andresakis
March 26, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
On the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
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SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
SMTA's Electronics in Harsh Environments Conference Program Announced
03/27/2026 | SMTASMTA is proud to announce the 2026 Electronics in Harsh Environments Conference, taking place 19-21 May in Amsterdam, Netherlands.
Best Technical Paper Awards Showcased at APEX EXPO 2026
03/02/2026 | Global Electronics AssociationThe Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.
Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)
02/18/2026 | Marcy LaRont -- Column: Marcy's MusingsThis month, I-Connect007 Magazine previews APEX EXPO 2026, from exhibitors and special events on the show floor to new insights from the technical conference, details on keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India. For PCB designers, we focused on AI in design tools, which turns out to be much more than the dreaded auto-router. We've got articles from Zuken, Siemens, and AllSpice.io.
Changing the Electronics Systems Conversation
02/16/2026 | Nolan Johnson, SMT007 MagazineRebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.