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Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
March 26, 2024 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania. With this strategic partnership, KIC aims to strengthen its presence in the region and continue its mission of delivering innovative solutions to the electronics manufacturing industry.
Don Dennison, a seasoned professional with extensive experience in the electronics industry, will play a vital role in promoting KIC’s next generation of solutions including the latest Thermal Analysis System software.
PIT Equipment Services, LLC has earned accolades for its outstanding performance in the electronics industry. With back-to-back prestigious Global Technology Awards for Rep of the Year for North America, PIT Equipment Services, LLC stands as a trusted partner to electronic assembly firms in the New York, New Jersey, and Eastern Pennsylvania areas.
Established in 1988, PIT Equipment Services, LLC has built a reputation for assisting electronics assembly companies. Under Dennison's leadership, the company has remained dedicated to delivering exceptional service, leveraging extensive product knowledge, and fostering strategic customer relationships.
“We are honored to represent KIC,” said Don Dennison, President of PIT Equipment Services, LLC. “KIC’s innovative solutions have transformed what it means to profile, coming out with industry firsts for process setup, optimization, and inspection solutions in all soldering and curing applications on the electronics manufacturing production floor. We look forward to working closely with KIC to bring these cutting-edge technologies to our valued customers in the region.”
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Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.