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The Relevance of VeCS as an HDI Process Option

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Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

Viasat Selects Rocket Lab to Build GEO Satellite for U.S. Space Force Program

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NVIDIA Partners With Major Firms to Mobilize $500B for AI Infrastructure

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Teledyne Marine Advances Allied Undersea Capabilities During AUKUS Exercise Lanternfish

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Teledyne Marine, representing a group of subsea technology providers within Teledyne Technologies Incorporated, participated in Exercise Lanternfish 2026, a multinational AUKUS Pillar 2 exercise focused on advancing seabed warfare capabilities and protecting critical undersea infrastructure.
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