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Machine Vision Products Unveils Versa Duo and Advanced Deep Learning AI Tools at IPC APEX EXPO 2024
April 2, 2024 | Machine Vision ProductsEstimated reading time: 1 minute

Machine Vision Products (MVP) is thrilled to announce the debut of its latest innovation, the Versa Duo, aiming to reshape Automated Optical Inspection capabilities.
Furthermore, MVP is proudly unveiling its groundbreaking integration of Deep Learning AI Tools, now available across all our platforms.
As industry leaders in global inspection solutions, MVP continues to push boundaries and drive technological advancement.
The Versa Duo: Redefining Precision and Efficiency
Designed to meet the demands of the most challenging products, the Versa Duo introduces unparalleled 3D SMT and SPI Inspection. Leveraging a unique blend of high-resolution optics technologies and laser profiler, this platform offers advanced inspection solutions across multiple markets. Key features of the Versa Duo include:
A computer on a machine
Description automatically generatedQuality Inspection: The Versa Duo allows for inspection in manufacturing environments that need the highest quality. Allowing for highest defect detection and measurement and traceability in a single platform.
Precision Motion System: Elevating automated inspection for SMT, the Versa Duo incorporates a precision granite stage, enhancing stability and reducing vibrations for heightened positional accuracy.
Advanced Laser Technology: With a repeatability of 0.5 um, users can trust in the precision and reliability of results delivered by the Versa Duo system.
Access to MVP's Algorithm Capabilities: Benefit from decades of field-proven defect and measurement-based capabilities, empowering users with comprehensive inspection solutions.
Deep Learning and AI Tools: Setting New Standards in Inspection Performance
Building upon years of expertise in automated learning software, MVP introduces a new era of Deep Learning and AI integration. Integrated into the latest 8.4 software and algorithm structure, these advancements achieve unparalleled levels of inspection performance, even in the most complex challenges. Additionally, MVP offers an open platform for the integration of third-party AI tools, providing unparalleled flexibility for users.
Experience MVP's Latest Innovations at IPC APEX Expo 2024
Join MVP at the Anaheim Exhibition Center from April 9-11, 2024, during IPC APEX Expo 2024. Visit Booth 1404 to explore the Versa Duo and discover the capabilities of MVP's advanced Deep Learning AI Tools firsthand.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.